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Instruments DSBGA BGA Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole angled socket strip, 2x19, 2.00mm pitch, double rows Through hole pin header SMD 1x25 1.27mm single row Through hole socket strip THT 1x38 1.00mm single row Through hole straight pin header, 1x21, 1.00mm pitch, 2.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header SMD 2x38 1.27mm double row Through hole pin header THT 2x21 2.00mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, single row Through hole straight pin header, 1x22, 1.27mm pitch, single row Through hole straight pin header, 2x28, 1.00mm pitch, double rows Through hole angled pin header, 2x06, 2.54mm pitch, single row Through hole pin header SMD 2x22 1.00mm double row Through hole angled pin header THT 2x21 2.54mm double row Through hole angled pin header THT 2x09 1.00mm double row surface-mounted straight pin header, 2x33, 1.27mm pitch, double cols (from Kicad.

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