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B9P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator JST J2100 series connector, S08B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1310, with PCB locator, 13 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py mlf 8 2x2 mm 16-Lead Quad Flat, No Lead Package (MC) - 2x3x0.9 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (http://www.ti.com/lit/ds/symlink/ads1115.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 2.5, Wuerth electronics 9775086360 (https://katalog.we-online.com/em/datasheet/9775086360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 24 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 48 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [QFN] with thermal pad LQFP, 32 Pin (https://www.ti.com/lit/ds/symlink/ads127l01.pdf#page=87), generated with kicad-footprint-generator Harting har-flexicon vertical Harting har-flexicon series connector, B15B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-794069-x, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 6-pin SOT-23 package, Handsoldering, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sot-23rj/rj_8.pdf SOT-143R, reverse pinning, Handsoldering, https://www.nxp.com/docs/en/package-information/SOT143R.pdf module CMS SOT223 5 pins, pitch 5.08mm, size 15.2x10.6mm^2, drill diamater 1.15mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block Phoenix PT-1,5-11-3.5-H pitch 3.5mm size 35x7.6mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 804-305 45Degree pitch 7.5mm size 15x10.3mm^2 drill 1.3mm pad 2.6mm Altech AK300 serie terminal block RND 205-00053 pitch 5mm size 30x9.8mm^2 drill.

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