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Back9.5mm Vishay IM-10-37 Inductor, Axial series, Axial, Horizontal, pin pitch=35mm, , length*diameter=29*13mm^2, Electrolytic Capacitor, , http://www.vishay.com/docs/28342/058059pll-si.pdf CP Radial series Radial pin pitch 7.62mm 7W length 25mm width 9mm Alps rotary encoder, PEC09, without switch, horizontal shaft, https://www.bourns.com/docs/product-datasheets/pec12r.pdf Sensortech MiCS MEMS sensor Infineon, IP57, XENSIV, LGA-5, https://www.infineon.com/dgdl/Infineon-IM73A135-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017fadec36b84500 MEMS Microphone LGA Dust Water TDK InvenSense MEMS I2S ICS-43434 TDK InvenSense MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf), generated with kicad-footprint-generator JST ZE series connector, 502382-1470 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator JST PHD series connector, S7B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-121-02-xx-DV-PE-LC, 21 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 18 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN, 4mm x 3mm (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081731_C_DE14MA.pdf Linear UKG52(46) package, QFN-52-1EP variant (see http://cds.linear.com/docs/en/datasheet/3886fe.pdf MLF, 6 Pin (https://www.nxp.com/docs/en/package-information/SOT457.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0310, with PCB locator, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP Switch SPST Slide 8.61mm 338mil SMD LowProfile.
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- OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF.