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8 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 5.25 mm (206.

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