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1
Back

SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias in pads, 4 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002304A.pdf (page 43)), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-26DP-2DSA, 13 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 87437-1443, 14 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with.

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