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Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems PSOF-7, 4.8x6.4mm Body, 1.60mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS780-Datasheet.ashx Allegro Microsystems 24-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_8_05-08-1698.pdf DFN, 8 Pin (http://www.ixysic.com/home/pdfs.nsf/www/IX4426-27-28.pdf/$file/IX4426-27-28.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xxx-DV, 19 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2.5 mm² wire, reinforced insulation, conductor diameter 1.4mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310861_RT034xxHBLC_OFF-026114K.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type703_RT10N02HGLU pitch 9.52mm size 19x12.5mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00290, 5 pins, single row Through hole straight pin header, 1x02, 1.00mm pitch, 2.0mm pin length, single row Through hole angled socket strip, 1x34, 2.54mm pitch, single row male, vertical entry, strain relief clip Harwin LTek Connector, 17 pins, single row Through hole socket strip THT 2x13 2.00mm double row Through hole straight socket strip, 2x02, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 1x20 2.54mm single row Through hole angled pin header THT 2x32 2.54mm double row Through hole straight pin header, 1x02, 2.54mm pitch, 6mm pin length, single row Through hole vertical IDC box header 2x25 2.54mm double row surface-mounted straight socket strip, 1x31, 2.54mm pitch, 6mm pin length, single row Surface mounted socket strip SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x21 2.00mm single row style2 pin1 right Through hole straight Samtec HPM power header series 11.94mm post length, 1x18, 5.08mm pitch, single row (from Kicad 4.0.7.

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