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Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic QFN (3mm x 2mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip SMD 2x40 1.27mm double row Through hole socket strip THT 2x33 2.54mm double row Through hole angled socket strip, 1x38, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x06, 2.00mm pitch, 4.2mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD 1x21 2.00mm single row Through hole angled pin header SMD 2x16 2.00mm double row Through hole straight socket strip, 2x02, 1.00mm pitch, 2.0mm pin length, single row Surface mounted pin header SMD 1x35 1.00mm single row Through hole angled socket strip SMD 1x17 1.27mm single row Through hole socket strip SMD 2x14.

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