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MBS diode bridge Single phase bridge rectifier case 16.7x16.7 Vishay GBU rectifier diode bridge Low Profile 8x8mm PQFN, Dual Cool 88, https://www.onsemi.com/pub/Collateral/FDMT80080DC-D.pdf TO-50-4 Power Macro Package Style M236 TO-50-4 Macro X Package Style M238 TO-252 / DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/ NDW0007A SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-3-1/ TO-263/D2PAK/DDPAK SMD package, orientation marker at anode, https://media.digikey.com/pdf/Data%20Sheets/CREE%20Power/CLM3A-BKW,GKW.pdf LED, SMD, 0404, 1x1x1.65mm, https://www.we-online.com/catalog/datasheet/150044M155260.pdf Electrosmith Daisy Seed Microcontroller Module ARM Cortex-M7 Audio Codec ESP8266 development board Common footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZR pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic Stretched Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001800C.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 12, Wuerth electronics 97730456334 (https://katalog.we-online.com/em/datasheet/97730456334.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FF0829SA1, 29 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 38 Pin (JEDEC MO-153 Var HB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: GMSTB_2,5/11-GF-7,62; number of pins: 12; pin pitch: 3.81mm; Angled; threaded flange || order number: 1777125 12A || order number: 1843305 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/2-GF-5.08; number of pins: 03; pin pitch: 3.81mm; Angled; threaded flange || order number: 1847657 8A 320V Generic Phoenix Contact.

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