Labels Milestones
Back0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A.
- Vertex 4.13852 7.16813 19.9688 facet normal 3.036929e-01 -9.527700e-01.
- 4.798183e-01 -8.773678e-01 3.384709e-04 vertex -9.410987e+01.