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S12B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Stretched Small Outline (SM) - 5.28 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads.

0.801129 0.594342 -0.0703598 facet normal 0.532805 0.843308 0.0703631.
-4.567763e+000 -3.354764e+000 9.983999e+000 vertex 9.238088e-001 6.974807e+000.
-9.289963e+01 9.327794e+01 3.455000e+01 vertex.
0.00317369 18.9333 vertex 2.05117 2.05117 18.9335 facet.

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