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PLCC, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 20 Pin (https://www.holtek.com/documents/10179/116723/sop20-300.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 501920-4001, 40 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, DF52-2S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 14 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 2.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 3.5mm, hole diameter 2.0mm wire loop with bead as test Point, square 4.0mm side length, hole diameter 1.3mm, wire diameter 1.0mm THT rectangular pad.

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