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Lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 16 leads; body width 4.4 mm; thermal pad TSSOP HTSSOP 0.65 thermal pad LQFP, 32 Pin (JEDEC MO-153 Var EA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-14DS-0.5V, 14 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator connector JST SFH series connector, 501331-0607 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with.

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