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Female XT60, through hole, DF13-07P-1.25DS, 7 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf), generated with kicad-footprint-generator JST PUD series connector, LY20-32P-DT1, 16 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 5, Wuerth electronics 9774070982 (https://katalog.we-online.de/em/datasheet/9774070982.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/xtr111.pdf#page=27), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EC), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BD), generated with kicad-footprint-generator JST SH series connector, 502585-1370 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-167 , 7 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DD), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 1.5, Wuerth electronics 9775041960 (https://katalog.we-online.com/em/datasheet/9775041960.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (JEDEC MO-153 Var EC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py DC6 Package; 6-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 10-Lead Plastic XDFN (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf Thermally-enhanced SO-8 PowerPAK PQFN Q5A PowerFLAT LFPAK SOT669 WPAK(3F) LFPAK Power56 PMPAK PowerDFN56 HSOP8 PRPAK56 PDFN HVSON QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.8mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-8/CP_8_13.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0040, 4 Circuits (https://www.molex.com/pdm_docs/sd/2005280040_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.7mm, outer diameter 1mm.

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