3
1
Back

S-XBGA-N5 Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip SMD 1x37 2.54mm single row Through hole straight socket strip, 2x20, 2.00mm pitch, single row Surface mounted pin header SMD 1x06 1.00mm single row Surface mounted socket strip THT 2x02 2.54mm double row Through hole IDC header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole straight pin header, 2x03, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip.

New Pull Request