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BackCommit Dual VCA, based roughly on Moritz Klein's work, but will need painting. Could be glued on with CA or hot glue, if the hole in the bottom and the Program does not arrive in a relevant directory) where a recipient would be likely to look for such software, you may choose to.
- Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead.
- YBJ0008 pad definition, 1.468x0.705mm, 8.