synth_tools

Back

Block pitch 7.62mm length 23.37mm diameter 12.7mm Vishay IHA-203 Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, , length*diameter=26*11mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf Inductor Axial series Axial Horizontal pin pitch 2.50mm diameter 3.8mm width 2.6mm Capacitor C, Rect series, Radial, pin pitch=10.00mm, , length*width=11.0*2.8mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 7.62mm length 26.67mm diameter 13.97mm Vishay IHA-104 Inductor, Axial series, Axial, Horizontal, pin pitch=10.16mm, , length*diameter=4*2mm^2, , http://www.diodes.com/_files/packages/DO-35.pdf Diode DO-35_SOD27 series Axial Vertical pin pitch 2.50mm diameter 6.3mm height 7mm Non-Polar Electrolytic Capacitor C Radial series Radial pin pitch 10.00mm length 11.5mm width 3.2mm Capacitor C, Disc series, Radial, pin pitch=14.61mm, , diameter=21mm, Vishay, IHB-2, http://www.vishay.com/docs/34015/ihb.pdf Inductor Radial series Radial pin pitch 2.54mm size 28.4x6.5mm^2 drill 1.1mm pad 2.2mm Terminal Block Phoenix PTSM-0,5-5-2.5-V-THR, vertical (cable from top), 10 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package (ML) - 8x8x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 4x-dip-switch SPST , Piano, row spacing 5.25 mm (206 mils), body size 10.8x11.72mm 4x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD DIP Switch SPST Slide 7.62mm 300mil SMD 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 5.9 mm (232 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion.

New Pull Request

Labels Milestones