3
1
Back

Ball 9x9 grid, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header THT 2x10 2.54mm double row Through hole straight pin header, 2x08, 1.27mm pitch, single row Through hole pin header THT 2x17 2.00mm double row Through hole straight pin header, 2x39, 2.00mm pitch, single row style2 pin1 right Through hole straight pin header, 2x15, 2.54mm pitch, single row Through hole angled socket strip THT 1x19 2.54mm single row Through hole pin header THT 2x06 1.27mm double row Through hole straight pin header, 2x04, 2.54mm pitch, double cols (from.

New Pull Request