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(see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62840.pdf#page=37), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (JEDEC MO-153 Var GC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Fuse SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.15 mm² wire, reinforced insulation, conductor diameter 0.65mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-127-02-xx-DV-TE, 27 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST KingTek_DSHP09TJ, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 5.25 mm (206 mils), body size 10.8x6.64mm 2x-dip-switch SPST , Slide, row spacing 5.25 mm (206 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 10x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic.

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