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2mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CM.PDF DFN, 14 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xxx-DV, 19 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-115-02-xxx-DV-BE, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 9x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST CTS_Series194-4MSTN, Piano, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST KingTek_DSHP09TJ, Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 10.8x16.8mm 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST Copal_CVS-08xB, Slide, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils.

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