synth_tools

Back

Size 55x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00051 pitch 5mm size 10x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00290, 5 pins, pitch 7.5mm, size 45x11mm^2, drill diamater 1.2mm, pad diameter 1.4mm, outer diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00068 pitch 7.5mm size 22.5x9mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix MKDS-1,5-12 pitch 5mm size 40x9mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type094_RT03504HBLU pitch 5mm size 25x9.8mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type059_RT06303HBWC, 3 pins, pitch 10mm, size 162x14mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00056_DB_EN.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix PT-1,5-10-3.5-H, 10 pins, pitch 6.35mm, hole diameter 1.0mm wire loop with bead as test Point, diameter 3.0mm SMD pad SMD pad as test Point, square 2.5mm side length test point wire loop with bead as test Point, diameter 4.0mm Plated Hole as test Point, square 1.0mm side length, hole diameter 0.5mm test point THT pad as test Point, diameter 2.0mm 2 pins LED_Oval, Oval, Oval size 5.2x3.8mm^2, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-144GDT(Ver.14B).pdf LED_Rectangular Rectangular Rectangular size 5.0x2.0mm^2 z-position of LED center 2.0mm, 2 pins, diameter 5.0mm 2 pins Red 5381 Series LED Yellow 5381 Series LED VCCLite https://vcclite.com/wp-content/uploads/wpallimport/files/files/5381Series.pdf http://static.vcclite.com/pdf/Mounting%20Hole%20Pattern%202.pdf Red 5381 Series LED A20 Olinuxino LIME2, 1.2GHz, 512-1024MB RAM, Micro-SD, NAND or eMMC, 1000Mbit Ethernet A20 Olimex Olinuxino LIME2 development board Common footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27 FBGA-96, 14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBJ0008 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil Socket 3M 28-pin zero insertion force socket, though-hole, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

New Pull Request

Labels Milestones