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BackBGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7!), script generated Surface mounted pin header SMD 2x34 2.00mm double row Through hole straight socket strip, 1x13, 1.27mm pitch, single row Through hole straight pin header, 1x31, 2.54mm pitch, double rows Through hole angled pin header THT 2x07 2.54mm double row Through hole angled socket strip, 2x13, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x17 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x09, 2.54mm pitch, 6mm pin length, single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x06, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7.
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