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9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST GH series connector, B13B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5130, 13 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1410, with PCB locator, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.75 mm² wire, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1105, 5 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/(UHE36)%20QFN%2005-08-1876%20Rev%20%C3%98.pdf), generated with kicad-footprint-generator Diode, Universal, SMA (DO-214AC) SMB (DO-214AA) Modified (http://www.littelfuse.com/~/media/electronics/datasheets/sidactors/littelfuse_sidactor_battrax_positive_negative_modified_do_214_datasheet.pdf.pdf Diode, Universal, SMC (DO-214AB), RM10, Handsoldering, SMD, Thruhole, Diode Universal SMC (DO-214AB) Handsoldering Diode SMB (DO-214AA) Handsoldering Diode SMA (DO-214AC) Handsoldering Diode, Universal, SMA (DO-214AC) or SMB (DO-214AA), Handsoldering, Diode Universal SMC (DO-214AB) RM10 Handsoldering SMD Thruhole Diode, MicroMELF, Reflow Soldering, http://www.vishay.com/docs/85597/bzm55.pdf Diode, MicroMELF, Reflow Soldering, http://www.vishay.com/docs/85597/bzm55.pdf Diode, MicroMELF, Reflow Soldering, http://www.vishay.com/docs/85597/bzm55.pdf Diode Mini-MELF (SOD-80) Handsoldering Microsemi Powermite 3 SMD power inductor, 5.8x5.2x4.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-1004 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5340 Microsemi Powermite 2 SMD power inductor, CWR1242C, H=4.5mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf inductor sagami cer12xxb smd Inductor.

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