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BackFiles a/caixa_sr1.png and b/caixa_sr1.png differ Binary files /dev/null and b/Panels/FireballSpell.png differ Binary files /dev/null and b/3D Printing/Rails/18hp_outie.stl differ Binary files /dev/null and b/Images/PXL_20210831_000922493.jpg differ Binary files a/Panels/futura medium condensed bt.ttf | Bin 0 -> 138868 bytes Docs/precadsr_bom.md | 72 Hardware/PCB/precadsr/potsetc.sch | 533 Hardware/PCB/precadsr/precadsr.sch | 247 (40 Dwgs.User user hide (48 B.Fab user hide From d48d677c9103ec90137a6830434841a576342e9a Mon Sep 17 00:00:00 2001 Subject: [PATCH] Adding SynthMages footprint library Examples: https://www.youtube.com/watch?v=-2No01KfY4k https://youtu.be/Jeh8iTI6gMc?t=96 https://youtu.be/frLXzG9-W3Q?t=712 (until 15:50) and de Miranda Score (Or PDF. BSD: Back surdos (L for low, H for high) R/L: accented note (right/left hand suggested r/l Quieter, unaccented note * : trill, generally three very fast notes on updating the fireball for rev 2 beta by adding +5V, and both trigger/gate and CV on the https://www.onsemi.com/pub/Collateral/NCP115-D.PDF Panasonic HQFN-16, 4x4x0.85mm (https://industrial.panasonic.com/content/data/SC/ds/ds7/c0/PKG_HQFN016-A-0404XZL_EN.pdf Panasonic HSON-8, 8x8x1.25mm (https://industrial.panasonic.com/content/data/SC/ds/ds7/c0/PKG_HSON008-A-0808XXI_EN.pdf QFN, 12 Pin Placed - Wide, 5.3 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Shrink Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin (https://www.haloelectronics.com/pdf/discrete-ultra-100baset.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-103-02-xxx-DV-BE-LC, 3 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator.
- R21 | 2 Smaller cap (476nF?) for C1.
- -3.345441e-04 vertex -1.019954e+02 9.338116e+01 2.550000e+00 facet.
- Printer_hole_scale parameter (or similar) to scale holes.
- 5.008889e-002 -8.468474e-002 9.951480e-001 facet normal 0.114117 -0.0998673 0.988435.
- -9.92995 2.94279 facet normal 9.986508e-01 -1.901550e-03 5.189467e-02.