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X 3mm MLF - 3x3x0.85 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 14 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-144-02-xxx-DV-LC, 44 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Fuse, 3 x switching (normalling) stereo jack (T/R/S), https://www.neutrik.com/en/product/nj3fd-v 6.35mm (1/4 in) Vertical Jack, 2 Poles (Mono / TS), Switched T Pole (Normalling) | | S2 | 1 Kosmo_panel | 1 | SW_Push | Push button switch with ground pin http://www.ckswitches.com/media/1479/kmr2.pdf tactile push button, 6x6mm e.g. PHAP33xx series, height=5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=8mm tactile push button, 6x6mm e.g. PHAP33xx series, height=5mm tactile push button, 6x6mm e.g. PTS645xx series, height=9.5mm tactile push button, 6x6mm e.g. PTS645xx series, height=9.5mm tact sw push 6mm.

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