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80 ball 9x9 grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias.

• 2-826576-0, 20 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated.
• -2.38614 19.9509 vertex 9.41211 0 20.0916.

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