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SPST Omron_A6H-4101, Slide, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 5x-dip-switch SPST KingTek_DSHP05TJ, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 12x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27 FBGA-96, 14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm LFCSP, 16 Pin (https://www.ti.com/lit/ds/symlink/tlv9064.pdf#page=44), generated with kicad-footprint-generator JST NV series connector, B09B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ri_soic_ic/ri_16_1.pdf.

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