Labels Milestones
BackSSOP48: plastic shrink small outline package; 20 leads; body width 4.4 mm; Exposed Pad Variation BB; (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [UDFN] (see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA), generated.
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