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BackNumber: 1777170 12A || order number: 1843871 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/7-GF; number of pins: 06; pin pitch: 3.50mm; Angled || order number: 1755765 12A || order number: 1776702 12A || order number: 1827884 8A 160V Generic Phoenix Contact connector footprint for: GMSTB_2,5/10-GF-7,62; number of pins: 05; pin pitch: 7.62mm; Vertical || order number: 1776948 12A || order number: 1829167 12A 630V Generic Phoenix Contact SPT 2.5/5-H-5.0 Terminal Block, 1732564 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732564), generated with kicad-footprint-generator Hirose BM24 40pin header Hirose BM24 40pin header Hirose BM24 40pin header Hirose BM24 40pin header Hirose BM24 40pin header Hirose BM24 series connector, SM06B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator connector Molex SL vertical Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-0810, 8 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 8.89 mm (350 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch.
- Package, 3x3mm, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0.
- 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm.