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See http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header SMD 1x25 1.27mm single row Through hole IDC header, 2x32, 2.54mm pitch, 6mm pin length, double rows Through hole IDC header, 2x13, 2.54mm pitch, double rows Surface mounted pin header THT 2x05 2.54mm double row Through hole socket strip SMD 1x23 1.00mm single row Surface mounted pin header THT 1x20 2.54mm single row style2 pin1 right Through hole angled pin header THT 1x09 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 1x40, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header, 2x20, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x34 1.00mm single row Surface mounted pin header THT 2x24 2.00mm double row Through hole straight pin header, 2x31, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x21 2.00mm double row Through hole horizontal IDC header THT 1x33 2.54mm single row male, vertical entry, with latches, PN:G125-MVX1005L1X Harwin Gecko Connector, 6 pins, pitch 2.5mm, size 15.5x5mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flatpack (PT) - 10x10x1.0 mm Body [QFN]; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (https://datasheet.lcsc.com/lcsc/2303241700_Zetta-ZDSD64GLGEAG-R_C5277948.pdf#page=17), generated with kicad-footprint-generator JST XA series connector, 505405-1170 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf.

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