Labels Milestones
BackHLE-133-02-xxx-DV, 33 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-132-02-xxx-DV-BE-LC, 32 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator JST SHL series connector, B18B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator LED SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-0200 (alternative finishes: 43045-160x), 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp-16-40.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 8.6, Wuerth electronics 9774060951 (https://katalog.we-online.de/em/datasheet/9774060951.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 60 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator JST GH series connector, SM05B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-10DP-0.5V, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, DF3EA-09P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0310, with PCB cutout, light-direction upwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf package for diode bridges, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils SMD DIP Switch SPST Slide 5.25mm 206mil JPin SMD 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide.