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Https://www.switchcraft.com/Drawings/RAPC10U_CD.pdf barreljack switchcraftconxall dc power Thin-pin DC Barrel Jack, https://www.cliffuk.co.uk/products/dcconnectors/FC681465S.pdf Surface-mount DC Barrel Jack, 2.0mm ID, 5.5mm OD, 24V, 8A, no switch, https://www.cui.com/product/resource/pj-063ah.pdf barrel jack cui dc power Wuerth electronics 9776080960 (https://katalog.we-online.com/em/datasheet/9776080960.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xx-DV-PE-LC, 37 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xx-DV-PE-LC, 25 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 42819-42XX, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST VH series connector, DF3EA-04P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM20B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2108, 10 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-60DS-0.5V, 60 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, B11B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B14B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (https://www.silabs.com/documents/public/data-sheets/si7210-datasheet.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST Copal_CHS-10A, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL ZIF 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 12x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, through-hole, row spacing 9.53 mm (375 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD DIP DIL ZIF 10.16mm 400mil Socket LongPads 64-lead though-hole.

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