Labels Milestones
BackKosmo\_panel directories. Panels/FireballSpell.dxf Executable file View File 3D Printing/Pot_Knobs/Pot4.STL Executable file View File Panels/luther_triangle_vco.scad Executable file View File Hardware/PCB/precadsr_aux_Gerbers/precadsr-B_Mask.gbr Normal file Unescape Hardware/Panel/precadsr-panel/precadsr-panel.sch Normal file View File 398c2b234c Checkpoint after converting most things to SMD 55ee65a5e94ad245f04db09ef472959294e7cca0 Still trying to fit in glide controls 812d609d12 More assembly notes 45c41b9873 More mounting hole 6mm no annular m2.5 din965 Mounting Hole 3.2mm, M3, ISO14580 mounting hole 2.7mm m2.5 Mounting Hole 3.2mm, M3, DIN965 mounting hole 4.3mm no annular Mounting Hole 3.7mm, no annular Mounting Hole 2.7mm, no annular, M3, ISO14580 mounting hole 6mm no annular mounting hole 2.1mm no annular mounting hole 8.4mm no annular Mounting Hole 3.2mm, no annular, M3 mounting hole 4.3mm no annular Mounting Hole 3.2mm, no annular, M3 mounting hole 8.4mm m8 Mounting Hardware, inside blind hole M1.6, height 6, Wuerth electronics 9775096360 (https://katalog.we-online.com/em/datasheet/9775096360.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 4 times 2 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [UQFN]; (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (JEDEC MO-153 Var HB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py DE Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_32.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM12B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13), generated with kicad-footprint-generator Molex PicoBlade series connector, 53780-0670 (), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2391, 23 Circuits (https://www.molex.com/pdm_docs/sd/2005280230_sd.pdf), generated with kicad-footprint-generator JST EH series connector, DF52-15S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline.
- 1.881520e-15 -5.428596e-15 1.000000e+00 facet normal.
- Branch smt_version Notes about component heights, swapping.
- A4 Updates from real TL0x4s d12ec1f19bbae8f01395e4c76a152d3d4ce7a3d4 More.