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105309-xx03, 3 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 1 mm² wires, basic insulation, conductor diameter 2.4mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PTSM-0,5-6-2.5-V-THR, vertical (cable from top), 10 pins, pitch 5mm, size 55x12.6mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 236-106 45Degree pitch 5mm size 40x9mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix PT-1,5-9-3.5-H pitch 3.5mm size 18.2x7mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 804-116, 45Degree (cable under 45degree), 14 pins, pitch 3.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42819-62XX, With thermal vias in pads, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-J (1608-08 Metric), IPC_7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator JST SH series connector, SM08B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 42820-62XX, With thermal vias in pads, 5 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7!), script generated Surface mounted pin header SMD 1x33 1.00mm single row style2 pin1 right Through hole pin header SMD 1x25 2.54mm single row Through hole straight socket strip, 1x40, 2.54mm pitch, 8.51mm socket length, double rows Through hole pin header SMD 2x03 2.00mm double row surface-mounted straight socket strip, 2x29, 2.00mm pitch, 6.35mm socket length, single row (from Kicad 4.0.7!), script generated Surface mounted socket strip THT 2x35 2.00mm double row Through hole straight socket strip, 2x36, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight pin header, 1x23, 2.00mm pitch, single row Surface mounted pin header SMD 1x13 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x36 2.54mm double row Through hole straight socket strip, 1x18, 1.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header, 2x04, 2.00mm pitch, 4.2mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted socket strip SMD 1x31 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x25 2.54mm single row Through hole angled socket strip.

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