synth_tools

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205-00052, 9 pins, pitch 5mm, size 62.3x14mm^2, drill diamater 1.1mm, pad diameter 2.2mm, see http://www.mouser.com/ds/2/324/ItemDetail_1725672-916605.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type205_RT04505UBLC 45Degree pitch 7.5mm size 15x9mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type011_RT05502HBWC, 2 pins, pitch 10mm, size 122x14mm^2, drill diamater 1.15mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00001_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-11-5.0-H, 11 pins, pitch 7.5mm, size 122x14mm^2, drill diamater 1.3mm, pad diameter 2.4mm, see , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MPT-0,5-12-2.54, 12 pins, single row style2 pin1 right Through hole angled pin header, 2x39, 2.00mm pitch, 6.35mm socket length, double rows Through hole IDC header, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x26, 2.00mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header, 2x01, 1.00mm pitch, double rows Through hole angled socket strip THT 2x26 1.00mm double row Through hole straight pin header, 1x05, 2.54mm pitch, 8.51mm socket length, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole vertical IDC box header, 2x07, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x31, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x03, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 5, row spacing 7.62 mm (300 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing.

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