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Sat 28 Aug 2021 07:18:14 PM EDT Thu 22 Apr 2021 10:22:18 AM EDT Generated from schematic into main 3d279dd88c Finish schematic, add PDF Fix for component clearance, panel thickness from printer realities L1 2 keahS oidaR DEF SW_Coded SW 0 40 Y Y 1 F N DEF SW_DIP_x06 SW 0 0 Y N 1 F N DEF SW_SPST_Temperature SW 0 0 Y N 1 F N DEF SW_DIP_x05 SW 0 0 Y N 1 F N DEF SW_Rotary2x6 SW 0 40 Y Y 1 F N DEF SW_E3_SA3216 SW 0 40 Y N 1 F N DEF SW_Push_Open_Dual_x2 SW 0 40 Y N 1 F N DEF 3_pin_Molex_connector J 0 40 Y Y 1 F N DEF SW_Reed_Opener SW 0 0 Sequencer based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile.

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