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Back(http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf UQFN, 16.
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- 0.63056 0.108238 facet normal.
- 8-440055-2 TE Connectivity Buchanan.
- 10698, vertical (cable from top), 2 pins.