3
1
Back

0.4mm pitch, 19 ckt, right angle through hole M2, height 4.5, Wuerth electronics 9775096960 (https://katalog.we-online.com/em/datasheet/9775096960.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Halo N6 SO, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14), generated with kicad-footprint-generator Hirose DF13 through hole, DF63-6P-3.96DSA, 6 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator ipc_noLead_generator.py WSON6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506BU.PDF 8-Lead Plastic Stretched Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 10.8x16.8mm 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 9.53 mm (375.

New Pull Request