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14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header THT 1x20 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x36 2.54mm single row Through hole angled pin header THT 1x01 1.27mm single row Through hole angled pin header SMD 2x17 2.54mm double row Through hole straight socket strip, 2x09, 2.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole pin header THT 2x39 2.54mm double row surface-mounted straight socket strip, 1x15, 2.00mm pitch, double rows Through hole angled pin header THT 2x10 1.00mm double row Through hole IDC header, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header THT 2x09 2.00mm double row surface-mounted straight socket strip, 2x23, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220.

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