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BackExposed pad 8-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 8x-dip-switch SPST.
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