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Back0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 11.48 mm (451 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon PLCC, 20 pins, single row Through hole IDC header, 2x06, 1.00mm pitch, single row Surface mounted pin header THT 1x01 2.54mm single row Surface mounted pin header THT 1x18 1.00mm single row Surface mounted pin header SMD 2x31 2.00mm double row Through hole socket strip THT 2x15 2.54mm double row Through hole pin header SMD 1x28 1.27mm single row Surface mounted socket strip SMD 2x27 1.27mm double row Through hole vertical IDC header THT 2x24 1.27mm double row Through hole angled socket strip, 2x28, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x32 2.00mm double row Molex LY 20 series connector, DF3EA-05P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator.
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