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Back1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole pin header SMD 1x24 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x03 2.00mm double row Through hole angled pin header SMD 1x06 1.00mm single row Surface mounted socket strip THT 2x23 1.27mm double row Through hole angled socket strip, 2x16, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header, 2x39, 2.54mm pitch, single row.
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