Labels Milestones
BackSided Module Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 2x08, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x12 2.00mm single row Through hole straight socket strip, 1x20, 1.27mm pitch, double rows Surface mounted pin header SMD 1x17 1.27mm single row Through hole angled pin header THT 1x29 1.27mm single row Through hole straight socket strip, 2x24, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x08, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT.
- 2.235948e-001 9.659167e-001 facet normal -4.116403e-001 7.082267e-001 5.735567e-001.
- Vertex -1.402180e+000 4.029114e+000 2.495526e+001.