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1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.st.com/resource/en/datasheet/ld1086.pdf#page=35), generated with kicad-footprint-generator JST ZE series connector, 202396-1507 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Through hole straight socket strip, 1x12, 2.00mm pitch, single row Surface mounted socket strip THT 1x03 2.54mm single row style1 pin1 left Surface mounted pin header THT 1x19 2.54mm single row style2 pin1 right Through hole angled socket strip, 1x26, 2.00mm pitch, 4.2mm pin length, double rows Through hole Samtec HPM power header series 3.81mm post length, 1x07, 5.08mm pitch, single row Surface mounted socket strip SMD 1x37 2.54mm single row style2 pin1 right Through hole pin header SMD 1x14 2.00mm single.

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