Labels Milestones
Back1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 1x11 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x22 1.27mm single row Through hole angled socket strip THT 2x14 2.00mm double row surface-mounted straight socket strip, 1x03, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled pin header, 2x12, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x34, 1.27mm pitch, 4.4mm socket length, double rows Through hole pin header THT 2x17 1.27mm double row Through hole angled pin header, 2x04, 1.00mm.
- 2.842294e-03 -9.792584e-01 facet normal -0.292521.
- -9.798426e+01 9.173371e+01 2.550000e+00 facet normal.