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Bottom (in mm). If you don't need to create a new fetcher, use the two clockwise-most pins, looking from below. Clock rate (B100k) (not sure yet which 2 pins diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 9.0mm, 2 pins, diameter 3.0mm z-position of LED center 2.0mm 2 pins Rectangular size 5.0x5.0mm^2 2 pins diameter 5.0mm z-position of LED center 2.0mm, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 3.0mm 2 pins LED, diameter 5.0mm z-position of LED center 2.0mm, 2 pins LED_Rectangular Rectangular Rectangular size 4.0x2.8mm^2 diameter 2.0mm, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LED8MMGE_LED8MMGN_LED8MMRT%23KIN.pdf LED diameter 5.0mm z-position of LED center 1.6mm, 2 pins LED, diameter 3.0mm z-position of LED center 1.0mm 2 pins diameter 5.0mm z-position of LED center 2.0mm 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 3 pins IR-LED, diameter 3.0mm, 2 pins, color: clear IR infrared LED diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 3.0mm, 2 pins, diameter 5.0mm z-position of LED center 2.0mm 2 pins LED, diameter 8.0mm, 2 pins, pitch 5mm, size 25x8.3mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times 2 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0730, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, S14B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1750.pdf), generated with kicad-footprint-generator JST EH series connector, SM13B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1021 (alternative finishes: 43045-042x), 2 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.megastar.com/products/fusetronic/polyswitch/PDF/smd2920.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B03B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf.

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