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DDB Package; 12-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row spacing 8.9 mm (350.

• Pin, exposed pad, thermal vias.
• -0.471368 0.881855 -0.0120138 facet.
• 100644 Hardware/PCB/precadsr_aux_Gerbers/precadsr-B_Cu.gbr create mode 100644 Hardware/PCB/precadsr/precadsr.sch create.
• Normal 0.111553 -0.367738 0.923214 facet normal 0.241732.

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