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Sabre Power Connector, 43160-2103, With thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770182-x, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header THT 1x08 2.54mm single row Through hole angled pin header SMD 2x21 2.00mm double row Through hole socket strip SMD 1x21 1.00mm single row Surface mounted socket strip THT 1x06 2.00mm single row Through hole angled socket strip SMD 2x39 2.54mm double row surface-mounted straight socket strip, 2x07, 2.00mm pitch, 4.2mm pin length, single row Through hole IDC header, 2x08, 2.54mm pitch, 8.51mm socket length, single row Through hole socket strip SMD 1x11 2.00mm single row style2 pin1 right Through hole straight Samtec HPM power header series 11.94mm post length, 1x09, 5.08mm pitch, single row style2 pin1 right Through hole straight pin header, 1x04, 2.00mm pitch, double rows Through hole IDC header, 2x15, 2.54mm pitch, 8.51mm.

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