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Connector, 53398-0271 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-03P-1.25DS, 3 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator JST SH side entry Molex MicroClasp Wire-to-Board System, 55932-0730, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Diode SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator JST ZE series connector, SM26B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf#page=23), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 0.65mm SSOP-8 2.95x2.8mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.5 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.75 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex PicoBlade series connector, S10B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST XH series connector, BM08B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Connector Phoenix Contact SPT 2.5/10-H-5.0-EX 1732467 Connector Phoenix Contact connector footprint for: MSTB_2,5/10-GF-5,08; number of steps. Exact configuration TBD. One SPDT switch per step, to set output voltages. (10) One potentiometer for internal clock rate. Binary files /dev/null and b/3D Printing/Rails/36hp_innie.stl differ Binary files a/3D Printing/AD&D 1e spell names in Filmoscope 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MOUTH.png' f707877a83 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin typeface Created by Cvpcb (2015-03-25 BZR 5536)-product date = sam. 04 avril 2015 11:21:18 UTC update=Tue 20 Apr 2021 10:22:18 AM EDT **Component Count:** 75 0 0 Y N 1 F N DEF Screw_Terminal_01x03 J 0 40 Y N 2 F N DEF 3_pin_Molex_header J 0 40 Y N 1 F N DEF SW_DIP_x05 SW 0 40 Y N 2 F N DEF SW_Reed_SPDT SW 0 0 PCM_kikit NPTH 0 0 Y N 2 F N DEF SW_Coded_SH-7040 SW 0 40 Y Y 1 F N DEF 2_pin_Molex_header J 0 40 Y Y 1 F N DEF SW_Push_LED SW.

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