synth_tools

Back

Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST , Piano, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 24-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100.

New Pull Request

Labels Milestones