3
1
Back

Pin (http://www.ti.com/lit/ml/mpqf391c/mpqf391c.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/ts3a27518e.pdf#page=33), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430fr5731.pdf#page=111 JEDEC MO-220 variant VEED-6), generated with kicad-footprint-generator ipc_noLead_generator.py LQFN, 12 Pin Placed - Wide, 5.3 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 10.8x32.04mm 12x-dip-switch SPST.

New Pull Request